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US 7,459,642 B2Granted
RIM slot filler module and method of manufacturing the same
AssigneeTeradyne, Inc.
InventorsMartin L. Culpepper, Rohit Girdhar, Sarosh M. Patel
Life of this patent
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Abstract
A slot filler module is presented. The slot filler module includes a RIM molded encapsulant, an insert disposed in a predetermined location within the encapsulant and a connector disposed proximate a first end of the RIM molded encapsulant.
Claims20
A slot filler module for replacing an optional electronics module in a system, comprising:
- a reaction injection molded (RIM) encapsulant;
- a connector assembly disposed proximate a first end of said encapsulant;
- and
- at least one insert disposed in a predetermined location embedded within said encapsulant,
- wherein said encapsulant and said at least one insert have approximately the same mass as the electronics module, and
- wherein the connector assembly comprises:
- at least one threaded insert disposed in said module;
- a connector disposed over said at least one threaded insert;
- and
- a fastener removably insertable within the at least one threaded insert, the fastener securing the connector to the module.
7 more elements
A slot filler module for replacing an optional electronics module in a system, comprising:
- a reaction injection molded (RIM) encapsulant;
- a latch assembly disposed proximate a second end of said encapsulant;
- and
- at least one insert disposed in a predetermined location embedded within said encapsulant,
- wherein said encapsulant and said at least one insert have approximately the same mass as the electronics module,
- wherein said latch assembly comprises:
- at least one threaded insert disposed in said module,
- a latch plate disposed over said at least one threaded insert;
- and
- a fastener removably insertable within said at least one threaded insert, said fastener securing said latch plate to said module.
7 more elements
A slot filler module for replacing an optional electronics module in a system, comprising:
- a reaction injection molded (RIM) encapsulant;
- a connector assembly disposed proximate a first end of said encapsulant;
- a cover disposed over at least a portion of said connector assembly;
- and
- at least one insert disposed in a predetermined location embedded within said encapsulant,
- wherein said encapsulant and said at least one insert have approximately the same mass as the electronics module.
3 more elements
Dependencies are inferred from the claim text.