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US 7,459,344 B2Granted
Method for forming micromachined structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hua Chang, Hua-Shu Wu
Life of this patent
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Abstract
The invention provides a method of fabricating a micromachined structure, and in particular to a method of forming a micro-electro-mechanical system (MEMS) structure. A thin silicon cantilevered or suspended structure used to make micromachined structures is first formed from a SOI wafer or a bulk silicon wafer, followed by formation of the micromachined structures by semiconductor manufacturing techniques.
Claims23
A method for forming a micromachined structure, comprising:
- providing a substrate having an intermediate layer interposed between a first layer and a second layer;
- patterning a free surface of the second layer;
- adhering the patterned free surface of the second layer to a first handle substrate via a first adhesive layer;
- removing the first layer;
- removing the intermediate layer to expose a surface of the second layer;
- releasing the first adhesive layer and the first handle substrate from the patterned free surface of the second layer;
- and
- bonding the patterned free surface of the second layer to a substrate with integrated circuit devices.
5 more elements
A method for forming a micromachined structure, comprising:
- providing a processing substrate;
- providing a handle substrate;
- adhering the processing substrate to the handle substrate via an adhesive layer;
- thinning the processing substrate;
- patterning a free surface of the processing substrate;
- bonding the patterned free surface of the processing substrate to a substrate with integrated circuit devices;
- and
- releasing the adhesive layer and the handle substrate from the processing substrate.
5 more elements
Dependencies are inferred from the claim text.