Method for making a surface acoustic wave device package
AssigneeI-Shou University
InventorChi-Yen Shen
Life of this patent
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Abstract
A method for making a SAW device package includes the steps of: forming a pattern of a metal layer, that defines transmitting and receiving transducers of a SAW die, on a wafer; forming a pattern of a first photo sensitive layer, which defines a peripheral wall of a cap of the SAW die, on the metal layer and the wafer through lithography techniques; forming a pattern of a second photo sensitive layer, which defines a cover wall of the cap of the SAW die, on the first photo sensitive layer through lithography techniques; curing the first and second photo sensitive layers; dicing the wafer into SAW dies; and encapsulating the SAW dies with a molding compound.
Claims4
A method for making a surface acoustic wave (SAW) device package that includes a SAW die having a piezoelectric substrate, and transmitting and receiving transducers and a cap formed on the substrate, the cap having a peripheral wall and a cover wall which cooperate with the substrate to define an embedded air cavity thereamong, said method comprising the steps of:
- forming a pattern of lift-off layer on a wafer surface of a wafer through lithography techniques;
- forming a metal layer on the wafer surface of the wafer and the lift-off layer through metallization techniques;
- removing the lift-off layer and the metal layer on the lift-off layer by dissolving the lift-off layer in a solution so as to form a pattern of the metal layer, that defines the transmitting and receiving transducers of the SAW die, on the wafer surface of the wafer;
- forming a pattern of a first photo sensitive layer, which defines the peripheral wall of the cap of the SAW die, on the metal layer and the wafer surface of the wafer through lithography techniques;
- forming a pattern of a second photo sensitive layer, which defines the cover wall of the cap of the SAW die, on the first photo sensitive layer through lithography techniques;
- curing the first and second photo sensitive layers;
- dicing the wafer into SAW dies;
- and
- encapsulating the SAW dies with a molding compound.
A method for making a SAW device package that includes a SAW die having a piezoelectric substrate, and transmitting and receiving transducers and a cap formed on the substrate, the cap having a peripheral wall and a cover wall which cooperate with the substrate to define an embedded air cavity thereamong, said method comprising the steps of:
- forming a metal layer on a wafer surface of a wafer through metallization techniques;
- forming a pattern of a photoresist layer on the metal layer through lithography techniques;
- etching an exposed portion of the metal layer that is exposed from the photoresist layer so as to form a pattern of the metal layer, which defines the transmitting and receiving transducers of the SAW die, on the wafer surface of the wafer;
- forming a pattern of a first photo sensitive layer, which defines the peripheral wall of the cap of the SAW die, on the metal layer and the wafer surface of the wafer through lithography techniques;
- forming a pattern of a second photo sensitive layer, which defines the cover wall of the cap of the SAW die, on the first photo sensitive layer through lithography techniques;
- curing the first and second photo sensitive layers;
- dicing the wafer into SAW dies;
- and
- encapsulating the SAW dies with a molding compound.
Dependencies are inferred from the claim text.