Module to couple to a plurality of backplanes in a chassis
AssigneeIntel Corporation
InventorsHassan Fallah-Adl, Edoardo Campini, Robert J. Albers
Life of this patent
Estimating the term…
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AssigneeIntel Corporation
InventorsHassan Fallah-Adl, Edoardo Campini, Robert J. Albers
Estimating the term…
A chassis includes a plurality of slots to receive modules. The chassis further includes a first backplane to couple to modules that are received in the plurality of slots. The modules are to couple to the first backplane via a first communication interface on each module. The chassis also includes a second backplane to couple to at least a subset of the modules via a second communication interface on each of the subset of modules. One of the backplanes may be located in an upper or lower air plenum and used to interconnect modules slid along the slots from opposite directions. Some of the module connectors may be retractable to enable the modules to move into the chassis. The interface may be electrical, optical inductive or capacitive.
A chassis comprising:
A method comprising:
A system comprising:
Dependencies are inferred from the claim text.