Method of inspecting integrated circuits during fabrication
AssigneeInternational Business Machines Corporation
InventorsColin J. Brodsky, MaryJane Brodsky
Life of this patent
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AssigneeInternational Business Machines Corporation
InventorsColin J. Brodsky, MaryJane Brodsky
Estimating the term…
A method, system and a computer program product for inspecting integrated circuit chips during fabrication. The method including: selecting an integrated circuit chip at a selected level of fabrication; determining coordinates of potential failures of the integrated circuit chip based on one or more risk of failure analyses performed ancillary to fabrication of the integrated circuit chip; automatically generating one or more enhanced defect inspection regions for inspecting the integrated circuit chip based on the coordinates; automatically selecting one or more enhanced defect inspection parameters for each of the enhanced defect inspection regions based on the one or more risk of failure analyses; and generating an enhanced defect inspection recipe, the enhanced defect inspection recipe including a location on the integrated circuit chip, an enhanced defect inspection parameter and a value for the enhanced defect inspection parameter for each of the one or more enhanced defect inspection regions.
A computer program product, comprising a computer readable medium having a computer readable program code embodied therein, said computer readable program code comprising an algorithm adapted to implement a method for inspecting integrated circuit chips during fabrication, said method comprising the steps of:
A computer program product, comprising a computer readable medium having a computer readable program code embodied therein, said computer readable program code comprising an algorithm adapted to implement a method for inspecting integrated circuit chips during fabrication, said method comprising the steps of:
Dependencies are inferred from the claim text.