Resist composition, method of forming resist pattern, semiconductor device and method of manufacturing thereof
AssigneeFujitsu Limited
InventorsTakahisa Namiki, Koji Nozaki, Miwa Kozawa
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AssigneeFujitsu Limited
InventorsTakahisa Namiki, Koji Nozaki, Miwa Kozawa
Estimating the term…
The resist composition of the present invention contains at least one of a tannin and a derivative thereof. The method of forming a resist pattern of the present invention includes: forming a resist film on a surface of an object to be processed, by using the resist composition; and exposing and developing the resist film. The method of manufacturing a semiconductor device of the present invention includes: forming a resist film on a surface of an object to be processed, by using the resist composition; exposing and developing the resist film to form a resist pattern; and patterning the surface of the object by performing an etching through the resist pattern as a mask.
A resist composition comprising one of a tannin and a derivative thereof, a crosslinking agent and a polymer at an amount that does not exceed 1/100 in a mass ratio with respect to the solid content of the resist composition, wherein the polymer has a simple repeating unit from a low molecule compound.
A method of forming a resist pattern comprising:
A method of manufacturing a semiconductor device comprising:
A resist composition comprising:
Dependencies are inferred from the claim text.