Heat sink mounting device and mounting method, and server blade using the same
AssigneeNEC Corporation
InventorKoichi Fujioka
Life of this patent
Estimating the term…
Loading patent…
AssigneeNEC Corporation
InventorKoichi Fujioka
Estimating the term…
A heat sink mounting device according to the present invention can secure a mounting space of the heat sink sufficiently, mount a heat sink with large capacity, and use a main board in common even when a dual central processing unit (CPU) is constituted by extension of CPU. A main board has an opening. A CPU is mounted on a main surface of the main board. A sub board is attached on the main surface of the main board to permit the opening to be covered. An extension CPU is mounted on the sub board through the opening from a rear face side of the main board. A first heat sink is mounted in the main surface side of the main board to permit the CPU and the opening to be covered. A second heat sink is mounted in the rear face side of the main board to permit the extension CPU and the opening to be covered.
A heat sink mounting device comprising:
A heat sink mounting method comprising:
Dependencies are inferred from the claim text.