Heat sink for electronic device
AssigneeAsia Vital Components Co., Ltd.
InventorChi Ai
Life of this patent
Estimating the term…
Abstract
A heat sink for the electronic device is disclosed. The heat sink comprises a hub, a plurality of first supporting elements and a frame. A fan is axially connected to the hub. The first supporting elements are positioned along the periphery of the hub and protrude outwards extending from the protruding ends to connect to the frame. The frame forms an outlet and connects to a heating element. Thus, the outlet and the fan have the side opposite to the fan set facing the heating element so that the distance between the fan and the heating element may be reduced. Thus, the loss of the air flow pressure may be minimized and the heat dissipation effect may be effectively promoted.
Claims7
A heat sink for an electronic device comprising
- a hub with a first end and a second end;
- a fan being positioned next to said hub and axially connected to said first end;
- a cage-shaped frame having a hollow-plate-shaped frame base, which forms an air outlet, and having a space for receiving said fan and said hub in a way of said fan being disposed next to said air outlet;
- and
- a heating element being secured to said frame base
- wherein, said frame further comprises:
- a plurality of first supporting elements extending outward radially from a circular edge of said second end in a way of said first supporting elements equidistantly spacing apart from each other with a distal end of the respective first supporting element being attached to said frame base;
- at least a second supporting element surrounding said first end and being joined to said first supporting elements;
- and
- a plurality of third supporting elements being disposed between said first supporting elements in a way of equidistantly spacing apart from each other and being joined to said second supporting element and said frame base.
Dependencies are inferred from the claim text.