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US 7,442,636 B2Granted
Method of inhibiting copper corrosion during supercritical CO2 cleaning
AssigneeTokyo Electron Limited
InventorJoseph Hillman
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Abstract
A method for the pre-treatment of a wafer substrates with exposed metal surfaces is disclosed. The pre-treatment reduces oxidation of the exposed metal surfaces during subsequent supercritical cleaning processes.
Claims33
A method of processing a semiconductor substrate having a patterned layer with exposed metal thereon, the method comprising the steps of:
- a) positioning the substrate on a substrate holder in a processing chamber;
- b) performing a corrosion inhibiting process using a first supercritical fluid limited to supercritical CO2 and corrosion inhibiting chemistry, the corrosion inhibiting chemistry comprising at least one of a nitrogen-based inhibitor and a sulfur-based inhibitor;
- and
- c) performing a cleaning process using a second supercritical fluid limited to supercritical CO2 and cleaning chemistry after the step performing the corrosion inhibiting process.
1 more element
Dependencies are inferred from the claim text.