Flexible carrier and release method for high volume electronic package fabrication

A method for use in manufacturing a device packaging comprising the steps of:

• positioning a metal substrate on a magnetic plate;
• placing a first tape layer on the metal substrate;
• placing a second tape layer on the first tape layer;
• positioning a mold frame on the second tape layer;
• placing multiple electronic devices on the second tape layer;
• positioning a die within the mold frame;
• depositing epoxy on the second tape layer and within the mold frame;
• curing the epoxy so as to create a molded panel containing the multiple electronic devices;
• removing the mold frame;
• grinding the molded panel to a desired thickness;
• separating the first tape layer from the second tape layer so as to separate the metal substrate from the molded panel;
• and
• peeling the second tape layer from a surface of the molded panel to expose the multiple electronic devices through the surface of the molded panel.

A method for use in manufacturing a device packaging comprising the steps of:

• positioning a metal substrate on a magnetic plate so as to expose a surface of the metal substrate;
• placing a nonstick material on the exposed surface of the metal substrate thereby creating a nonstick surface;
• placing a tape layer having a first major surface and a second major surface on the metal substrate such that the first major surface of the tape layer contacts the nonstick surface of the metal substrate, the first major surface disposed substantially opposite the second major surface;
• positioning a mold frame on the second major surface of the tape layer;
• placing multiple electronic devices on the second major surface of the tape layer;
• positioning a die within the mold frame;
• depositing epoxy within the mold frame on the second major surface of the tape layer;
• curing the epoxy so as to create a molded panel containing the multiple electronic devices;
• removing the mold frame;
• grinding the molded panel to a desired thickness;
• separating the metal substrate from the tape layer so as to separate the metal substrate from the molded panel;
• and
• peeling the tape layer from the molded panel without the use of solvents to expose the multiple electronic devices.