Placement of absorbing material in a semiconductor device
OwnerChien-Hua Chen, David M. Crald +1inventors
InventorsChien-Hua Chen, David M. Crald, Troy D. Schwinabart
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Abstract
A semiconductor device is provided that includes a hermetically sealed housing having a top member and a bottom member. A semiconductor die is enclosed within the housing and absorbing material is positioned under the semiconductor die.
Claims9
A method for depositing absorbing material in a housing of a semiconductor device, comprising the steps of:
- positioning the absorbing material in a recess of a bottom member of the housing;
- positioning a semiconductor die over the recess including depositing a porous material between the semiconductor die and the absorbing material;
- bonding the semiconductor die to a bottom member of the housing;
- and
- hermetically sealing the housing by bonding a top member of the housing to the bottom member of the housing.
A method for depositing absorbing material in a housing of a semiconductor device, comprising the steps of:
- positioning a semiconductor die over an aperture in a bottom member of the housing;
- bonding the semiconductor die to the bottom member of the housing;
- bonding a top member of the housing to the bottom member of the housing;
- positioning the absorbing material in the aperture and depositing a porous material between the semiconductor die and the absorbing material subsequent to bonding the top member to the bottom member;
- and
- hermetically sealing the housing.
A method for depositing absorbing material in a semiconductor device, comprising the steps of:
- enclosing the absorbing material in a casing, the casing including an aperture;
- bonding a semiconductor die to an interior surface of a bottom member of a housing, the bottom member including a port;
- bonding the casing on an exterior surface of the bottom member so that the aperture aligns with the port and the semiconductor die is positioned over the absorbing material;
- and
- hermetically sealing the housing by bonding a top member of the housing to the bottom member of the housing.
A method for assembling a semiconductor device having a top housing member and a bottom housing member, comprising the steps of:
- positioning the absorbing material within a space defined by the bottom housing member and a plurality of mounting pads on the bottom housing member;
- depositing a porous material on the absorbing material;
- securing a semiconductor die on the mounting pads;
- and
- hermetically sealing the housing by bonding the top housing member to the bottom housing member.
Dependencies are inferred from the claim text.