Semiconductor chip package and application device thereof
AssigneeQuarton, Inc.
InventorTony K. T. Chen
Life of this patent
Estimating the term…
Abstract
A semiconductor chip package has a pillar body including at least three conductors insulated from each other by an insulating layer. The pillar body has a periphery that includes a plurality of mounting faces, with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer. A plurality of semiconductor chips are attached on the mounting faces and selectively and electrically connected to the conductors. The semiconductor package of the present invention can be used in a semiconductor illuminator which has a housing having a reflecting cup, with the pillar body positioned inside the reflecting cup.
Claims21
A semiconductor chip package, comprising:
- a pillar body including at least three conductors insulated from each other by an insulating layer, the pillar body having a periphery that includes a plurality of mounting faces, with each conductor defining a portion of two adjacent mounting faces, and with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer;
- and
- a plurality of semiconductor chips attached on each of the mounting faces and selectively and electrically connected to the conductors.
A semiconductor chip package, comprising:
- a pillar body including at least three conductors insulated from each other by an insulating layer, the pillar body having a periphery that includes a plurality of mounting faces, with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer;
- and
- a plurality of semiconductor chips attached on each of the mounting faces and selectively and electrically connected to the conductors;
- wherein the insulating layer is positioned off-center on each mounting face.
A semiconductor chip package, comprising:
- a pillar body including at least three conductors insulated from each other by an insulating layer, the pillar body having a periphery that includes a plurality of mounting faces, with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer;
- and
- a plurality of semiconductor chips attached on each of the mounting faces and selectively and electrically connected to the conductors;
- wherein the semiconductor chips are LED chips.
A semiconductor illuminator, comprising:
- a housing having a reflecting cup;
- a pillar body positioned inside the reflecting cup, the pillar body including at least three conductors insulated from each other by an insulating layer, the pillar body having a periphery that includes a plurality of mounting faces, with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer;
- and
- a plurality of semiconductor chips attached on each of the mounting faces and selectively and electrically connected to the conductors.
Dependencies are inferred from the claim text.