Apparatus and method for verifying an integrated circuit pattern

A method of verifying an integrated circuit pattern comprising:

• generating image data of a pattern formed on a substrate according to a predetermined process by imaging the pattern;
• extracting contour data of the pattern from the generated image data;
• and
• determining whether or not a crossover between tolerance data generated based on a target pattern in the process and the extracted contour data corresponding to the tolerance data exists, wherein the tolerance data and the contour data are converted into polar coordinate data,
• wherein the tolerance data has upper and lower limit values corresponding to one of a distance from at least one side of a contact pattern to one side of a wiring pattern parallel to said one side when the wiring pattern is connected with the contact pattern, and a distance between the wiring pattern and the contact pattern when the contact pattern is formed adjacent to the wiring pattern.

A method of manufacturing a semiconductor device, comprising:

• generating image data of a pattern formed on a substrate according to a predetermined process by imaging the pattern;
• extracting contour data of the pattern from the generated image data;
• determining whether or not a crossover between tolerance data generated based on a target pattern in the process and the extracted contour data corresponding to the tolerance data exists, wherein the tolerance data and the contour data are converted into polar coordinate data;
• and
• outputting at least one instruction to modify said process or to modify the tolerance data when the crossover between the tolerance data and the contour data exists as the result of the determination,
• wherein the tolerance data has upper and lower limit values corresponding to one of a distance from at least one side of a contact pattern to one side of a wiring pattern parallel to said one side when the wiring pattern is connected with the contact pattern, and a distance between the wiring pattern and the contact pattern when the contact pattern is formed adjacent to the wiring pattern.