Optoelectronic alignment structures for the wafer level testing of optical and optoelectronic chips

A method of aligning an optical probe with an optoelectronic alignment structure disposed on an wafer, comprising:

• selecting an optical probe with a plurality of waveguides,
• selecting an electronic probe with a plurality of electrical conductors,
• selecting an optoelectronic alignment structure on the wafer,
• where the optoelectronic alignment structure comprises a first optical port, an optical detector and a waveguide coupled between the first optical port and the optical detector,
• positioning the optical probe above the wafer at a selected height,
• positioning the electronic probe with at least one electrical conductor coupled to the output of the optical detector,
• coupling a first light beam down from the first waveguide in the optical probe to the first optical port of the optoelectronic alignment structure on the wafer, where the first light beam propagates through the optoelectronic alignment structure to the optical detector,
• and
• maximizing the transmission of light through the optoelectronic alignment structure, by adjusting the lateral position of the optical probe with respect to the optoelectronic alignment structure on the wafer.