Heat-spreading devices for cooling computer systems and associated methods of use

A computer module assembly comprising:

• a substrate;
• an electronic device mounted to the substrate;
• and
• a cooling system mounted to the substrate, the cooling system including:
• a first heat exchanging portion positioned at least proximate to the electronic device and containing a working fluid that absorbs heat from the electronic device;
• a second heat exchanging portion positioned at least proximate to the first heat exchanging portion, wherein the second heat exchanging portion receives the heated working fluid from the first heat exchanging portion to cool the heated working fluid in an air flow path;
• and
• a fluid mover operably coupled to at least one of the first and second heat exchanging portions to circulate the working fluid through at least one of the first and second heat exchanging portions.

A method for cooling an electronic device mounted to a first computer module in a cabinet, the method comprising:

• positioning a first heat exchanger at least proximate to the electronic device;
• positioning a second heat exchanger at least proximate to the first heat exchanger;
• moving a working fluid through the first heat exchanger to absorb heat from the electronic device;
• moving the heated working fluid from the first heat exchanger to the second heat exchanger;
• and
• flowing air past the second heat exchanger to cool the heated working fluid.

A method for equalizing a temperature profile in a computer cabinet, the computer cabinet holding a plurality of computer modules carrying corresponding electronic devices, wherein at least two adjacent computer modules are spaced apart from each other to define an air flow path therebetween, the method comprising:

• positioning a first heat exchanger proximate to at least one of the electronic devices;
• positioning a second heat exchanger in the air flow path;
• at least partially vaporizing a working fluid in the first heat exchanger by absorbing heat from the at least one electronic device;
• moving the partially vaporized working fluid from the first heat exchanger to the second heat exchanger;
• flowing a first stream of air having a first air temperature along a first portion of the air flow path between the two adjacent modules;
• flowing a second stream of air having a second air temperature along a second portion of the air flow path between the two adjacent modules, the first air temperature being lower than the second air temperature;
• and
• transferring more heat from the partially vaporized working fluid to the first stream of air than to the second stream of air.

A system for cooling an electronic device mounted on a computer module in a computer cabinet, the system comprising:

• means for removing heat from the electronic device to a working fluid;
• means for moving a flow of air through the computer cabinet and past the computer module;
• and
• means for substantially equalizing a temperature of the air by exchanging heat between the heated working fluid and the flow of air past the computer module.