Electrostatic chucking device and manufacturing method thereof
AssigneesCreative Technology Ltd, Kawamura Sangyo Co., Ltd.
InventorsYoshiaki Tatsumi, Kinya Miyashita
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Abstract
An electrostatic chucking device having a laminated structure formed by sequentially laminating a first insulation layer, an electrode layer, and a second insulation layer on a metal substrate. The first and second insulation layers are formed from polyimide films. At least one adhesion layer is provided between the metal substrate and the first insulation layer, and is a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm.
Claims4
An electrostatic chucking device having a laminated structure which is formed by sequentially laminating a first insulation layer, an electrode layer and a second insulation layer on an aluminum alloy metal substrate, wherein the first insulation layer and the second insulation layer are constituted of polyimide films, and an adhesive layer between the aluminum alloy metal substrate and the first insulation layer wherein the adhesive layer includes a diamino siloxane-modified thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a compression bonding temperature of 100 to 200° C.
Dependencies are inferred from the claim text.