Integrated circuit package with partially exposed contact pads and process for fabricating the same

An integrated circuit package comprising:

• a semiconductor die mounted to a die attach pad;
• a plurality of contact pads circumscribing said die attach pad;
• each of said contact pads having,
• a central portion,
• an interior peripheral portion, located on an interior side of the central portion between the central portion and the die attach pad, and proximate to a first side of the central portion, and
• an exterior peripheral portion, located on an exterior side of the central portion, opposite the interior peripheral portion, and proximate a second side of the central portion,
• wherein the interior peripheral portion and the exterior peripheral portion have respective thicknesses less than a thickness of the central portion;
• wire bonds connecting said semiconductor die to at least one of said contact pads;
• an overmold covering a first side of said semiconductor die, said wire bonds, said internal peripheral portion of each of said contact pads, and a portion of the first side of said contact pads such that a remaining portion of said first side of said contact pads is uncovered and the second side of said contact pads is uncovered;
• external contacts disposed on said first side of said contact pads, at the uncovered remaining portion, the external contacts forming balls which protrude from said overmold;
• and
• at least one of an active and a passive component mounted to said second side of at least one of, said die attach pad and at least one of said contact pads,
• wherein a maximum thickness of the central portion of each of the plurality of contact pads is substantially equal to a combined thickness of the die attach pad and the semiconductor die.