Staggered wirebonding configuration
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorYi-Chuan Ding
Life of this patent
Estimating the term…
Abstract
The present invention discloses a staggered finger configuration comprising a plurality of first and second conducting wires alternately arranged on the substrate, wherein each of the first conducting wire connecting an inner and an outer fingers and each of the second conducting wire connecting an intermediate finger between the inner and the outer fingers, thereby forming a staggered configuration.
Claims20
A substrate for wire bonding, comprising a plurality of first and second conducting wires alternately arranged on a substrate, wherein each of the first conducting wires connects to a pair of inner and outer fingers, each of the second conducting wires connects to an intermediate finger which is located between the inner and the outer fingers, the inner fingers, the intermediate fingers and the outer fingers are located along a first row, a second row and a third row respectively, and the second row is located between the first row and the third row.
A semiconductor chip package, comprising:
- a substrate comprising a plurality of first and second conducting wires arranged alternately thereon, wherein each of the first conducting wires connects to a pair of inner and outer fingers, each of the second conducting wires connects to an intermediate finger which is located between the inner and the outer fingers, the inner fingers, the intermediate fingers and the outer fingers are located along a first row, a second row and a third row respectively, and the second row is located between the first row and the third row;
- a chip disposed on the substrate, having a plurality of bonding pads thereon;
- a plurality of first and second bonding wires arranged alternately with one ends thereof connecting to the inner, outer or intermediate fingers and the other ends thereof connecting to the bonding pads, wherein the first bonding wires connect to either the inner or the outer fingers, and the second bonding wires connect to the intermediate fingers;
- and a package material covering the chip, the first and second conducting wires, the first and second bonding wires and an upper surface of the substrate.
Dependencies are inferred from the claim text.