Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

A multi-chip module in an electronic device comprising:

• a base having a surface with a plurality of flip-chip pads thereon defining an area thereon at least partially bounded by a plurality of wire-bondable pads thereon, the plurality of flip-chip pads being interconnected with the plurality of wire-bondable pads such that the plurality of flip-chip pads as a group electrically mirror the plurality of wire-bondable pads as a group;
• a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon facing the surface of the base in alignment with and connected to the plurality of flip-chip pads on the surface of the base;
• and
• a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface facing the back-side surface of the first integrated circuit die in attachment therewith and the front-side surface having a plurality of bond pads thereon wire-bonded to the plurality of wire-bondable pads on the surface of the base.

A multi-chip module in an electronic device comprising:

• a base having a surface with a plurality of flip-chip pads thereon defining an area thereon at least partially bounded by a plurality of wire-bondable pads thereon, the plurality of flip-chip pads being interconnected with the plurality of wire-bondable pads such that the plurality of flip-chip pads as a group electrically mirror the plurality of wire-bondable pads as a group;
• a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon facing the surface of the base in alignment with and connected to the plurality of flip-chip pads on the surface of the base;
• a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface facing the back-side surface of the first integrated circuit die in attachment therewith and the front-side surface having a plurality of bond pads thereon wire-bonded to the plurality of wire-bondable pads on the surface of the base;
• and
• a third integrated circuit die having opposing front-side and back-side surfaces, the back-side surface facing the front-side surface of the second integrated circuit die in attachment therewith and the front-side surface having a plurality of bond pads thereon wire-bonded to the plurality of wire-bondable pads on the surface of the base.

A multi-chip module for use in an electronic device comprising:

• a printed circuit board having a surface having a first plurality of flip-chip pads thereon and a second plurality of wire-bondable pads thereon, at least one flip-chip pad of the first plurality of flip-chip pads connected to at least one wire bondable pad of the second plurality of wire-bondable pads on the surface of the printed circuit board;
• a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon and at least one flip-chip bump of the plurality of flip-chip bumps connected to at least one flip-chip pad of the first plurality of flip-chip pads on the surface of the printed circuit board;
• a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface of the second integrated circuit die attached to the back-side surface of the first integrated circuit die and the front-side surface of the second integrated circuit die having a plurality of bond pads thereon;
• and
• at least one wire connection between at least one bond pad of the plurality of bond pads on the front-side surface of the second integrated circuit die and the at least one wire-bondable pad of the second plurality of wire-bondable pads on the surface of the printed circuit board for connecting the same circuit of the first integrated circuit die and the second integrated circuit die through the printed circuit board.

A multi-chip module for use in an electronic device comprising:

• a base having a surface with a plurality of flip-chip pads thereon defining an area thereon at least partially bounded by a plurality of wire-bondable pads thereon, the plurality of flip-chip pads being interconnected with the plurality of wire-bondable pads such that the plurality of flip-chip pads as a group electrically mirror the plurality of wire-bondable pads as a group;
• a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon facing the surface of the base in alignment with and connected to the plurality of flip-chip pads on the surface of the base;
• and
• a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface facing the back-side surface of the first integrated circuit die in attachment therewith and the front-side surface having a plurality of bond pads thereon wire-bonded to the plurality of wire-bondable pads on the surface of the base.

A multi-chip module for use in an electronic device comprising:

• a base having a surface with a plurality of flip-chip pads thereon defining an area thereon at least partially bounded by a plurality of wire-bondable pads thereon, the plurality of flip-chip pads being interconnected with the plurality of wire-bondable pads such that the plurality of flip-chip pads as a group electrically mirror the plurality of wire-bondable pads as a group;
• a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon facing the surface of the base in alignment with and connected to the plurality of flip-chip pads on the surface of the base;
• a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface facing the back-side surface of the first integrated circuit die in attachment therewith and the front-side surface having a plurality of bond pads thereon wire-bonded to the plurality of wire-bondable pads on the surface of the base;
• and
• a third integrated circuit die having opposing front-side and back-side surfaces, the back-side surface facing the front-side surface of the second integrated circuit die in attachment therewith and the front-side surface having a plurality of bond pads thereon wire-bonded to the plurality of wire-bondable pads on the surface of the base.

A multi-chip module and an electronic device comprising:

• a base having a surface with a plurality of flip-chip pads thereon defining an area thereon at least partially bounded by a plurality of wire-bondable pads thereon, the plurality of flip-chip pads being interconnected with the plurality of wire-bondable pads such that the plurality of flip-chip pads as a group electrically mirror the plurality of wire-bondable pads as a group;
• a first integrated circuit die having opposing front-side and back-side surfaces, the front-side surface having a plurality of flip-chip bumps thereon facing the surface of the base in alignment with and connected to the plurality of flip-chip pads on the surface of the base;
• and
• a second integrated circuit die having opposing front-side and back-side surfaces, the back-side surface facing the back-side surface of the first integrated circuit die in attachment therewith and the front-side surface having a plurality of bond pads thereon wire-bonded to the plurality of wire-bondable pads on the surface of the base.