Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same

A die-down array integrated circuit (IC) device package, comprising:

• a heat spreader having opposing first and second surfaces, wherein said first surface of said heat spreader has a central cavity formed therein;
• a substrate having a first surface coupled to said first surface of said heat spreader, and having an array of electrically conductive terminals on a second surface, wherein said substrate further has a central opening that is open at said first and second surfaces of said substrate, wherein said central opening overlaps said central cavity;
• an IC die having a first surface mounted to said first surface of said heat spreader within said central cavity;
• at least one wire bond that couples at least one bond pad on a second surface of said IC die to at least one bond pad on said second surface of said substrate;
• and
• an interposer having opposing first and second surfaces, wherein a plurality of electrically conductive bumps on said second surface of said IC die is coupled to corresponding bond pads on said first surface of said interposer, wherein the interposer and the substrate are separate elements.