US 7,411,278 B2 · Package device with electromagnetic interference shield

Abstract

The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of the first substrate, and an insulating layer on the shielding structure. The first substrate includes a through hole that is filled with the conductor therein. A plurality of lead-frames located on the bottom surface of the first substrate. A second substrate located above between the two lead-frames. Then, the molding compound encapsulated to cover the above structures to form a package device. Therefore, the shielding path of the package device is constructed of the plurality of lead-frames, the conductor within the first substrate, the shielding structure, and the grounded to discharge the electromagnetic/radio frequency out of the package device, thus, the electromagnetic/radio frequency interference for the package device can be reduced.

Claims26

Dependent claims

A semiconductor package device, comprising:

a first substrate having a bottom surface, a top surface opposite to said bottom surface, a shielding structure and an electrical connecting structure, said shielding structure located on said bottom surface of said first substrate;
a plurality of lead-frames positioned on said top surface of said first substrate;
a plurality of conductive wires;
a plurality of first electronic devices electrically connected with each other via said plurality of conductive wires;
and
a circuit ground, said shielding structure electrically connected said circuit ground and one of said lead-frames via said electrical connecting structure.

3 more elements

Dependencies are inferred from the claim text.

Package device with electromagnetic interference shield

Life of this patent

Package device with electromagnetic interference shield

Life of this patent

Abstract

Claims26