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US 7,411,270 B2Granted
Composite capacitor and method for forming the same
AssigneeFreescale Semiconductor, Inc.
InventorsWon Gi Min, Geno L. Fallico, Amanda M. Kroll, Hongning Yang, Jiang-Kai Zuo
Life of this patent
Estimating the term…
Abstract
An electronic assembly (98) includes a substrate (20), a capacitor having first and second conductors (38,54) formed over the substrate, a first set of conductive members (76) formed over the substrate and being electrically connected to the first conductor of the capacitor, and a second set of conductive members (78) formed over the substrate and being electrically connected to the second conductor of the capacitor.
Claims10
An electronic assembly comprising:
- a substrate;
- a capacitor formed over the substrate, the capacitor comprising a first conductive plate having a first width and a first thickness and a second conductive plate formed over the first conductive plate and having a second width and a second thickness, the first and second widths being greater than the respective first and second thicknesses and extending in a direction that is substantially parallel to an upper surface of the substrate, wherein the first conductive plate has first and second portions and the first width is greater than the second width such that the second conductive plate covers only the second portion of the first conductive plate;
- a first set of conductive traces formed over the first and second conductive plates and being electrically connected to the first conductive plate of the capacitor;
- a second set of conductive traces formed over the first and second conductive plates and being electrically connected to the second conductor of the capacitor, wherein the first conductive plate and the first set of conductive traces jointly form a first capacitor electrode and the second conductive plate and the second set of conductive traces jointly form a second capacitor electrode such that when a voltage is applied across the first and second capacitor electrodes a charge is stored between the first and second capacitor electrodes, the first and second capacitor electrodes being separated by a distance;
- first and second conductive vias, the first conductive via interconnecting the first set of conductive traces and the first conductive plate and the second conductive via interconnecting the second set of conductive traces and the second conductive plate;
- and
- a plurality of insulating bodies positioned between the first and second capacitor electrodes such that the first and second capacitor electrodes are electrically disconnected.
4 more elements
A microelectronic assembly comprising:
- a semiconductor substrate having a semiconductor device formed therein;
- a first conductive plate formed on the semiconductor substrate;
- a second conductive plate formed over the first conductive plate, the first and second conductive plates jointly forming a capacitor, wherein the first conductive plate has first and second portions, a first width, and a first thickness, the first width being greater than the first thickness and extending in a direction that is substantially parallel to an upper surface of the substrate, the second conductive plate is formed over the first conductive plate and has a second width and a second thickness, the second width being less than the first width, greater than the second thickness, and extending in a direction that is substantially parallel to the first width, the second conductive plate covering only the second portion of the first conductive plate;
- a build up layer formed over the capacitor, the build up layer having a first set of conductive traces formed therein and being electrically connected to the first conductive plate and a second set of conductive traces formed therein and being electrically connected to the second conductive plate, wherein the first conductive plate and the first set of conductive traces jointly form a first capacitor electrode and the second conductive plate and the second set of conductive traces jointly form a second capacitor electrode such that when a voltage is applied across the first and second capacitor electrodes a charge is stored between the first and second capacitor electrodes;
- and
- a plurality of insulating bodies respectively positioned between the first and second capacitor electrodes such that the first and second capacitor electrodes are electrically disconnected.
3 more elements
A method for constructing an electronic assembly comprising:
- forming a capacitor over a substrate, the capacitor having first and second conductive plates, wherein the first conductive plate has first and second portions, a first width, and a first thickness, the first width being greater than the first thickness and extending in a direction that is substantially parallel to an upper surface of the substrate and the second conductive plate is formed over the first conductive plate and has a second width and a second thickness, the second width being less than the first width, greater than the second thickness, and extending in a direction that is substantially parallel to the first width, the second conductive plate covering only the second portion of the first conductive plate;
- forming a first set of conductive traces over the capacitor, the first set of conductive traces being electrically connected to the first conductive plate;
- and
- forming a second set of conductive traces over the capacitor, the second set of conductive traces being electrically connected to the second conductive plate, wherein the first conductive plate and the first set of conductive traces jointly form a first capacitor electrode and the second conductive plate and the second set of conductive traces jointly form a second capacitor electrode such that when a voltage is applied across the first and second capacitor electrodes a charge is stored between the first and second capacitor electrodes.
1 more element
Dependencies are inferred from the claim text.