Solid-state imaging device and method of manufacturing said solid-state imaging device

A solid-state imaging device comprising:

• a semiconductor substrate provided with an IT-CCD;
• and
• a translucent member connected to the semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
• wherein the translucent member constitutes an optical member having a condensing function,
• wherein the translucent member is connected to the semiconductor substrate through a spacer, and
• wherein the spacer is constituted by a 42-alloy or silicon.

A solid-state imaging device comprising:

• a first semiconductor substrate provided with an IT-CCD;
• and
• a translucent member having a condensing function which is connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
• wherein a second semiconductor substrate constituting a peripheral circuit is provided on the first semiconductor substrate,
• wherein the translucent member is connected to the first semiconductor substrate through a spacer, and
• wherein the spacer is constituted by the same material as that of the first semiconductor substrate.

A solid-state imaging device comprising:

• a first semiconductor substrate provided with an IT-CCD;
• and
• a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
• wherein a second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and
• the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate,
• wherein the first and second semiconductor substrates are bonded to each other with an adhesive layer in between.

A solid-state imaging device comprising:

• a first semiconductor substrate provided with an IT-CCD;
• and
• a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
• wherein a second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and
• the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate.
• wherein the first and second semiconductor substrates are bonded to each other with a heat insulating material in between.

A solid-state imaging device comprising:

• a first semiconductor substrate provided with an IT-CCD;
• and
• a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
• wherein a second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and
• the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate,
• wherein the first and second semiconductor substrates are bonded to each other with a magnetic shield material in between.

A solid-state imaging device comprising:

• a semiconductor substrate provided with an IT-CCD;
• and
• a translucent member connected to the semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
• wherein the translucent member constitutes an optical member having a condensing function, and
• wherein a peripheral edge portion of the translucent member is substantially aligned with a peripheral edge portion of the semiconductor substrate.

A solid-state imaging device comprising:

• a semiconductor substrate provided with an IT-CCD;
• and
• a translucent member connected to the semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
• wherein the translucent member constitutes an optical member having a condensing function,
• further comprising a bonding pad formed between the translucent member and the semiconductor substrate.

A solid-state imaging device comprising:

• a first semiconductor substrate provided with an IT-CCD;
• and
• a translucent member having a condensing function which is connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
• wherein a second semiconductor substrate constituting a peripheral circuit is provided on the first semiconductor substrate, and
• wherein a peripheral edge portion of the translucent member is substantially aligned with a peripheral edge portion of the first semiconductor substrate.

A solid-state imaging device comprising:

• a first semiconductor substrate provided with an IT-CCD;
• and
• a translucent member having a condensing function which is connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
• wherein a second semiconductor substrate constituting a peripheral circuit is provided on the first semiconductor substrate,
• further comprising a bonding pad formed between the translucent member and the first semiconductor substrate.

A solid-state imaging device comprising:

• a first semiconductor substrate provided with an IT-CCD;
• and
• a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
• wherein a second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and
• the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate, and
• wherein a peripheral edge portion of the translucent member is substantially aligned with a peripheral edge portion of the first semiconductor substrate.

A solid-state imaging device comprising:

• a first semiconductor substrate provided with an IT-CCD;
• and
• a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
• wherein a second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and
• the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate,
• further comprising a bonding pad formed between the translucent member and the first semiconductor substrate.