Contour structures to highlight inspection regions

An integrated circuit structure comprising:

• a wiring layer including a conductor wire;
• an insulator layer, including an inspection mark opening, on said wiring layer;
• a conductive layer on said insulator layer, wherein said conductive layer includes a topographical contour that overlies said inspection mark opening;
• and
• a passivation layer on said conductive layer, said passivation layer including an opening through which a portion of said conductive layer including said topographical contour that overlies said inspection mark opening is visible for inspection,
• wherein said topographical contour delineates said portion of said conductive layer visible for inspection into a wire bond region and a probe pad region, and
• wherein said probe pad region includes a visible area of damage.

An integrated circuit structure comprising:

• a wiring layer below said insulator layer said wiring layer comprising including a conductor wire;
• an insulator layer, including a wiring contact opening and an inspection mark opening, on said wiring layer;
• a conductive layer on said insulator layer, wherein said conductive layer includes a first topographical contour that overlies said wiring contact opening and a second topographical contour that overlies said inspection mark opening;
• and
• a passivation layer on said conductive layer, said passivation layer including an opening through which a portion of said conductive layer including said second topographical contour that overlies said inspection mark opening is visible for inspection,
• wherein said second topographical contour delineates said portion of said conductive layer visible for inspection into a wire bond region and a probe pad region, and
• wherein said probe pad region includes a visible area of damage.