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US 7,410,905 B2Granted
Method for fabricating thin film pattern, device and fabricating method therefor, method for fabricating liquid crystal display, liquid crystal display, method for fabricating active matrix substrate, electro-optical apparatus, and electrical apparatus
AssigneeSeiko Epson Corporation
InventorsToshihiro Ushiyama, Toshimitsu Hirai, Toshiaki Mikoshiba, Hiroshi Kiguchi, Hironori Hasei
Life of this patent
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Abstract
A method for fabricating a thin film pattern on a substrate, includes the steps of: forming a concave part on the substrate that conforms to the thin film pattern; and applying a function liquid into the concave part.
Claims8
A method for fabricating a thin film pattern on a substrate, comprising:
- building up banks on a surface of the substrate that conform to the thin film pattern;
- forming a concave part on the substrate between the banks;
- applying a function liquid into the concave part by using a droplet ejection method to form the thin film pattern;
- and
- removing the banks after applying the function liquid,
- the concave part being formed by etching, and being formed so as to include a reverse-taper profile gradually widening toward a base of the concave part, and
- the thin film pattern being formed so as not to protrude from the surface of the substrate.
4 more elements
The method for fabricating a liquid crystal display, comprising:
- forming a substrate groove in a substrate;
- forming a liquid repellent part so as to define the substrate groove;
- forming second banks that add further depth to the substrate groove during the forming of the liquid repelling part;
- forming a first conductive pattern by ejecting droplets that include a conducting material into the substrate groove from an ejection source;
- forming a first insulating layer so as to cover at least the first conductive pattern;
- removing the second banks before the forming the first insulating layer;
- forming transparent first banks on the first insulating layer that provide a thin film transistor comprising a thin film semiconductor;
- forming a second conductive pattern by ejecting droplets that include a conducting material into a formation region defined by the transparent first banks;
- and
- forming a second insulating layer so as to cover at least the transparent first banks and the second conductive pattern,
- the substrate groove being formed by etching, and being formed so as to include a forward-taper profile gradually widening toward the ejection source.
8 more elements
Dependencies are inferred from the claim text.