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US 7,410,851 B2Granted
Low voltage superjunction MOSFET
AssigneeInternational Rectifier Corporation
InventorsTimothy Henson, Jianjun Cao
Life of this patent
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Abstract
A power semiconductor switching device such as a power MOSFET that includes breakdown voltage enhancement regions formed by self-alignment.
Claims6
A process for manufacturing a power semiconductor device, comprising:
- providing a semiconductor body of a first conductivity and first charge level;
- forming a plurality of spaced gate structures on said semiconductor body, each gate structure including at least a gate insulation body, and a gate electrode;
- implanting first dopants of a second conductivity into said semiconductor body through spaces between said gate structures;
- diffusing said first dopants of said second conductivity to form a plurality of channel regions;
- implanting dopants of said first conductivity into said channel regions through said spaces between said gate structures to form source implant regions;
- implanting second dopants of said second conductivity through said spaces between said gate structures to a depth below the depth of said channel regions;
- and
- diffusing said second dopants to form breakdown voltage enhancing regions having a second charge level;
- wherein
- said first charge level and said second charge level are such that said breakdown voltage enhancing regions and said semiconductor body deplete one another under application of a reverse voltage.
7 more elements
Dependencies are inferred from the claim text.