Method of manufacturing a semiconductor device

A method of manufacturing a semiconductor device, comprising the steps of:

• providing a lead frame including leads, each lead having first and second surfaces positioned on opposite sides thereof and having a plurality of recessed portions formed therein, the recessed portions being formed from the second surface toward the first surface and being spaced from each other along a projecting direction of the first surface;
• forming a resin sealing body which seals the leads partially, and from a back surface of which the second surfaces of the leads are exposed;
• forming a plating layer over the first surface, the second surface, and an inner wall surface of the recessed portions of each of the leads, the plating layer being higher in solder wettability than each of the leads;
• and
• cutting each lead such that at least one recessed portion thereof and at least part of another recessed portion thereof are exposed from said resin sealing body after the cutting.

A method of manufacturing a semiconductor device, comprising the steps of:

• providing a lead frame including leads, each lead having first and second surfaces positioned on opposite sides thereof and having a plurality of recessed portions, the recessed portions being formed from the second surface toward the first surface and being spaced from each other along a projecting direction of the first surface;
• forming a resin sealing body which seals the leads partially, and from a back surface of which the second surfaces of the leads are exposed;
• forming a plating layer over the first surface, the second surface, and an inner wall surface of the recessed portions of each of the leads, the plating layer being higher in solder wettability than a second end face of each of the leads;
• and
• cutting the leads.

A method of manufacturing a semiconductor device, comprising the steps of:

• providing a lead frame including leads, each lead having first and second surfaces positioned on opposite sides thereof and having a plurality of recessed portions, the recessed portions being formed from the second surface toward the first surface and being spaced from each other along a projecting direction of the first surface;
• forming a resin sealing body which seals the leads partially, and from a back surface of which the second surfaces of the leads are exposed;
• forming a plating layer over the first surface, the second surface, and inner wall surfaces of the plural recessed portions in each of the leads, the plating layer being higher in solder wettability than a second end face of each of the leads;
• and
• cutting the leads such that at least one of the plural recessed portions in each of the leads is contiguous with a cut surface of the lead after the cutting.