Method and device for dividing plate-like member

Abstract

In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and dividing the plate-like member along this modified region. The method for dividing a plate-like member includes a tape sticking step which involves sticking tape on the surface of the plate-like member, a modified region forming step which involves forming a modified region on surface of the plate-like member or in the interior of the plate-like member, and an expanding step which involves elongating the tape by applying a tension thereto after the modified region forming step. In the expanding step, the tape is irradiated with UV rays. As a result of this, it is possible to positively manufacture an ultrathin chip with a good end-face shape in which uncut portions, chipping and breakage do not occur.

Dependencies are inferred from the claim text.