Back to results
US 7,410,830 B1Granted
Leadless plastic chip carrier and method of fabricating same
AssigneeASAT Ltd.
InventorsChun Ho Fan, Tsui Yee Lin, Ping Sheung Lau
Life of this patent
Estimating the term…
Abstract
A process for fabricating a leadless plastic chip carrier includes providing a leadframe including a plurality of contacts circumscribing a void; fixing a heat sink to the contacts of the leadframe using an intermediate non-electrically conductive adhesive such that the heat sink spans the void; mounting a semiconductor die to the heat sink in the void; wire bonding ones of the contacts to the pads of the semiconductor die; encapsulating the semiconductor die and the wire bonds in a molding material and singulating the leadless plastic chip carrier.
Claims22
A process for fabricating a plurality of leadless plastic chip carriers, comprising:
- providing a leadless plastic chip carrier strip comprising a plurality of leadframes, each leadframe comprising a plurality of contacts circumscribing a void, said contacts having an exterior portion and an interior portion, said interior portion being located between said external portion and said semiconductor die, and said interior portion having a height in a direction normal to an upper surface of said semiconductor die which is less than a height of the exterior portion;
- fixing a heat sink to said plurality of contacts of each leadframe using an electrically non-conductive adhesive such that each heat sink spans one of said voids;
- mounting a semiconductor die to each heat sink, in said void;
- wire bonding at least one of said plurality of contacts of each leadframe to at least one of a plurality of pads of each semiconductor die;
- encapsulating each semiconductor die and said wire bonds in a molding material such that an upper surface of the exterior portion of each of said contacts is exposed, and an interior portion of each of said contacts is encapsulated;
- and
- singulating said leadless plastic chip carrier strip to form a plurality of leadless plastic chip carriers.
4 more elements
A process for fabricating a plurality of leadless plastic chip carriers, comprising:
- providing a leadless plastic chip carrier strip comprising a plurality of leadframes, each leadframe comprising a plurality of contacts circumscribing a void;
- fixing a heat sink to said plurality of contacts of each leadframe using an electrically non-conductive adhesive such that each heat sink spans one of said voids;
- mounting a semiconductor die to each heat sink, in said void;
- wire bonding at least one of said plurality of contacts of each leadframe to at least one of a plurality of pads of each semiconductor die;
- encapsulating each semiconductor die and said wire bonds in a molding material such that at least a portion of an upper surface of each of said contacts is exposed, and at least a portion of the upper surface of each of said contacts is encapsulated;
- and
- singulating said leadless plastic chip carrier strip to form a plurality of leadless plastic chip carriers,
- wherein fixing said heat sink to said contacts of said leadframe using the electrically non-conductive adhesive comprises applying an electrically non-conductive adhesive film to said heat sink and hot pressing said heat sink to said contacts.
5 more elements
A process for fabricating a plurality of leadless plastic chip carriers, comprising:
- providing a leadless plastic chip carrier strip comprising a plurality of leadframes, each leadframe comprising a plurality of contacts circumscribing a void;
- fixing a heat sink to said plurality of contacts of each leadframe using an electrically non-conductive adhesive such that each heat sink spans one of said voids;
- mounting a semiconductor die to each heat sink, in said void;
- wire bonding at least one of said plurality of contacts of each leadframe to at least one of a plurality of pads of each semiconductor die;
- encapsulating each semiconductor die and said wire bonds in a molding material such that at least a portion of an upper surface of each of said contacts is exposed and at least a portion of the upper surface of each of said contacts is encapsulated;
- and
- singulating said leadless plastic chip carrier strip to form a plurality of leadless plastic chip carriers,
- wherein fixing said heat sink to said contacts of said leadframe using the intermediate electrically non-conductive adhesive comprises screen printing an electrically non-conductive epoxy on to said heat sink, locating said leadframe on to said heat sink, and curing said epoxy.
5 more elements
A leadless plastic chip carrier comprising:
- a heat sink;
- a semiconductor die fixed to said heat sink;
- a plurality of contacts fixed to said heat sink by an electrically non-conductive adhesive such that said contacts circumscribe said semiconductor die, said contacts having an exterior portion and an interior portion, said interior portion being located between said external portion and said semiconductor die, and said interior portion having a height in a direction normal to an upper surface of said semiconductor die which is less than a height of the exterior portion;
- a plurality of wire bonds connecting at least one of a plurality of pads of said semiconductor die to at least one of said contacts;
- and
- a molding material encapsulating said semiconductor die and said wire bonds such that upper surfaces of said exterior portions of said contacts are exposed from said molding material and said interior portions of said contacts are encapsulated.
3 more elements
Dependencies are inferred from the claim text.