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US 7,410,667 B2Granted
Method of applying a radiation cured resin with a transparent, removable overlay
AssigneeMedhesives, Inc.
InventorsAnthony R. Eisenhut, Eric D. Eisenhut
Life of this patent
Estimating the term…
Abstract
A process of using a transparent overlay device with a resin for repairing a small hole in a pipe includes applying an adhesive resin to a transparent overlay; applying the adhesive resin to a pipe surface over a hole and curing the adhesive resin through the application of a light source.
Claims19
A process of using a transparent overlay device with an adhesive resin for repairing a hole in a pipe, comprising:
- applying an adhesive resin to a transparent overlay;
- applying the adhesive resin and overlay to a pipe surface over a hole;
- curing the adhesive resin through the application of light from a light source;
- and
- removing the overlay once the resin is cured.
2 more elements
A process of using a transparent overlay device with an adhesive resin for repairing a hole in a pipe, comprising:
- applying a single component adhesive resin to a transparent overlay;
- applying the adhesive resin and overlay to a pipe surface over a hole;
- curing the adhesive resin through the application of light from a light source within the visible light frequency range;
- and
- removing the overlay once the resin is cured.
2 more elements
Dependencies are inferred from the claim text.