Optical waveguide type iontophoresis sensor chip and method for packaging sensor chip

Abstract

An optical waveguide type iontophoresis sensor chip has a substrate having a first hinged plate and a second hinged plate, an optical waveguide plate connected to the first hinged plate and positioned over a first opening delineated in the first hinged plate, and a gel layer fixed on the second hinged plate and covering a second opening delineated in the second hinged plate and configured to contact with the optical waveguide plate through the first opening in case that the substrate is folded.

Dependencies are inferred from the claim text.