Transferable micro spring structure

A method for producing an apparatus including a micro spring structure, the method comprising:

• forming a spring island over the substrate such that the spring island has a stress gradient;
• forming a second layer of release material over a first portion of the spring island;
• forming a base structure over the second layer of release material and a second portion of the spring island;
• securing the base structure to the apparatus such that the spring island is located between the apparatus and the substrate;
• and
• removing the substrate and releasing the second portion of the spring island by removing the second layer of release material,
• wherein forming the base structure comprises selectively forming a conductive inner frame on the second layer of release material and a second portion of the spring island, and then forming an outer contact portion on the inner frame.

A method for producing an apparatus including a plurality of micro spring structures, the method comprising:

• forming a plurality of spring islands over a substrate, the plurality of spring islands being formed with a stress gradient including at least one of a relatively tensile region and a relatively compressive region;
• forming a plurality of second release material portions, each second release material portion being formed over a first portion of a corresponding spring island;
• forming a plurality of base structures, each base structure being formed over a corresponding second release material portion and a second portion of an associated spring island,
• wherein forming the plurality of base structures comprises selectively forming a conductive inner frame on the second release material portion and a second portion of the spring island, and then forming an outer contact portion on the inner frame.