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US 7,410,091 B2Granted
Method of integrated circuit assembly
AssigneeSTMicroelectronics S.r.l.
InventorJean-Paul Farroni
Life of this patent
Estimating the term…
Abstract
A method of integrated circuit assembly before encapsulation including at least one step of soldering, under mechanical pressure, a first element on a second element, including temporarily maintaining a predetermined spacing, at least partially without solder paste, between the surfaces to be assembled of the first and second elements.
Claims23
A method of integrated circuit assembly before encapsulation, the method comprising:
- at least one step of soldering under mechanical pressure a first element to a second element with solder paste that includes first solder paste elements and second solder paste elements, including temporarily maintaining a predetermined spacing between the first and second elements with the first solder paste elements to provide a space between the first and second elements that lacks solder paste;
- and
- heating the solder paste to allow the second element to move closer to the first element and to fill the space with solder paste.
A method of integrated circuit assembly before encapsulation, the method comprising:
- at least one step of soldering under mechanical pressure a first element to a second element with solder paste that includes first solder paste elements and second solder paste elements, each of the first solder paste elements being of greater size than each of the second solder paste elements, including temporarily maintaining a predetermined spacing between the first and second elements with the first solder paste elements to provide a space between the first and second elements that lacks solder paste.
Dependencies are inferred from the claim text.