Conductive bonding material fill techniques

A method of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate, the method comprising:

• placing a fill head in substantial contact with a circuit supporting substrate, wherein the circuit supporting substrate includes at least one cavity;
• providing one of a linear motion and a rotational motion to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate;
• forcing conductive bonding material out of the fill head toward the circuit supporting substrate;
• providing the conductive bonding material into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head;
• bringing a second circuit supporting substrate in close proximity to the circuit supporting substrate, wherein at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity;
• and
• filling the at least one cavity such that at least one electrical contact in one or more layers of the at least one cavity is brought into electrical contact with the conductive bonding material in the at least one cavity, wherein the at least one electrical contact tenninates at a sidewall of the at least one cavity.

A method of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate, the method comprising;

• placing a fill head in substantial contact with a circuit supporting substrate, wherein the circuit supporting substrate includes at least one cavity;
• providing one of a linear motion and a rotational motion to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate;
• forcing conductive bonding material out of the fill head toward the circuit supporting substrate;
• providing the conductive bonding material into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head;
• bringing a second circuit supporting substrate in close proximity to the circuit supporting substrate, wherein at least one receiving nad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity;
• channeling a first gas about a first edge of the fill head, the first gas having a temperature above a melting point of the conductive bonding material thereby maintaining the conductive bonding material in a molten state as the conductive bonding material and the at least first gas are in close proximity to one another;
• and
• channeling a second gas about a second edge of the fill head, the second gas having a temperature below the melting point of the conductive bonding material thereby substantially solidifying the conductive bonding material within the at least one cavity as the at least one cavity passes under the second region of the fill head with the at least second gas.