Solder preform for low heat stress laser solder attachment

A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second end, the groove being larger in size than the optical fiber to allow alignment of the optical fiber within the groove such that the solder preform is configured to permit alignment of the optical fiber in first and second directions when the groove of the solder preform is placed over the optical fiber,

• the body having a length defined as a distance between the first end and the second end, a height defined as a distance between the bottom surface and a top surface opposite the bottom surface, and a width defined as a distance between a third end and a fourth end opposite the third end,
• the groove having a height dimension relative to the height of the body and width dimension relative to the width of the body, wherein a ratio of said height dimension to said width dimension is about 1.1:1 to about 1.9:1.