Film bulk acoustic wave resonator, film bulk acoustic wave resonator filter and method of manufacturing film bulk acoustic wave resonator

A film bulk acoustic wave resonator filter including a plurality of film bulk acoustic wave resonators comprising:

• a substrate having a plurality of cavities;
• an underlayer formed on said substrate to cover said cavities;
• a bottom electrode layer formed on top of said underlayer;
• a piezoelectric layer formed on top of said bottom electrode layer;
• and
• a top electrode layer formed on top of said piezoelectric layer,
• wherein the underlayer thickness in a first region where a first resonator of said plurality of resonators is formed differs from the underlayer thickness in a second region where a second resonator of said plurality of resonators is formed,
• wherein the underlayer has a top surface and a bottom surface, the bottom electrode layer being formed on the top surface of the underlayer, and
• wherein a bottom portion of the underlayer in at least one of said first region and said second region extends into a corresponding one of said cavities.

A film bulk acoustic wave resonator filter including a plurality of film bulk acoustic wave resonators comprising:

• a substrate having a plurality of cavities;
• an underlayer formed on said substrate to cover said cavities;
• a bottom electrode layer formed on top of said underlayer;
• a piezoelectric layer formed on top of said bottom electrode layer;
• and
• a top electrode layer formed on top of said piezoelectric layer,
• wherein the underlayer thickness in a first region where a first resonator of said plurality of resonators is formed differs from the underlayer thickness in a second region where a second resonator of said plurality of resonators is formed,
• wherein the underlayer has a top surface and a bottom surface, the bottom electrode layer being formed on the top surface of the underlayer,
• a bottom portion of the underlayer in each of the first region and the second region extends into a corresponding one of said cavities, and
• the bottom portion of the underlayer in the first region extends further into its corresponding cavity than the bottom portion of the underlayer in the second region.

A transmitting and receiving filter complex including a plurality of film bulk acoustic wave resonators comprising:

• a substrate having a plurality of cavities;
• an underlayer formed on said substrate to cover said cavities;
• a bottom electrode layer formed on top of said underlayer;
• a piezoelectric layer formed on top of said bottom electrode layer;
• and
• a top electrode layer formed on top of said piezoelectric layer,
• wherein said plurality of resonators' resonant frequencies can be adjusted, depending on the thickness of said underlayer over said cavities,
• wherein a first resonator of said plurality of resonators and a second resonator of said plurality of resonators constitute a transmitting filter and a third resonator of said plurality of resonators and a fourth resonator of said plurality of resonators constitute a receiving filter, and
• wherein the underlayer thickness in a first region where said first resonator is formed, the underlayer thickness in a second region where said second resonator is formed, the underlayer thickness in a third region where said third resonator is formed, and the underlayer thickness in a fourth region where said fourth resonator is formed differ from one another,
• wherein the underlayer has a top surface and a bottom surface, the bottom electrode layer being formed on the top surface of the underlayer, and
• wherein the top surface of the underlayer is planar.

A transmitting and receiving filter complex including a plurality of film bulk acoustic wave resonators comprising:

• a substrate having a plurality of cavities;
• an underlayer formed on said substrate to cover said cavities;
• a bottom electrode layer formed on top of said underlayer;
• a piezoelectric layer formed on top of said bottom electrode layer;
• and
• a top electrode layer formed on top of said piezoelectric layer,
• wherein said plurality of resonators' resonant frequencies can be adjusted, depending on the thickness of said underlayer over said cavities,
• wherein a first resonator of said plurality of resonators and a second resonator of said plurality of resonators constitute a transmitting filter and a third resonator of said plurality of resonators and a fourth resonator of said plurality of resonators constitute a receiving filter, and
• wherein the underlayer thickness in a first region where said first resonator is formed, the underlayer thickness in a second region where said second resonator is formed, the underlayer thickness in a third region where said third resonator is formed, and the underlayer thickness in a fourth region where said fourth resonator is formed differ from one another,
• wherein the underlayer has a top surface and a bottom surface, the bottom electrode layer being formed on the top surface of the underlayer, and
• wherein a bottom portion of the underlayer in at least one of said first to fourth regions extends into a corresponding one of said cavities.

A transmitting and receiving filter complex including a plurality of film bulk acoustic wave resonators comprising:

• a substrate having a plurality of cavities;
• an underlayer formed on said substrate to cover said cavities;
• a bottom electrode layer formed on top of said underlayer;
• a piezoelectric layer formed on top of said bottom electrode layer;
• and
• a top electrode layer formed on top of said piezoelectric layer,
• wherein said plurality of resonators' resonant frequencies can be adjusted, depending on the thickness of said underlayer over said cavities,
• wherein a first resonator of said plurality of resonators and a second resonator of said plurality of resonators constitute a transmitting filter and a third resonator of said plurality of resonators and a fourth resonator of said plurality of resonators constitute a receiving filter, and
• wherein the underlayer thickness in a first region where said first resonator is formed, the underlayer thickness in a second region where said second resonator is formed, the underlayer thickness in a third region where said third resonator is formed, and the underlayer thickness in a fourth region where said fourth resonator is formed differ from one another,
• wherein the underlayer has a top surface and a bottom surface, the bottom electrode layer being formed on the top surface of the underlayer,
• a bottom portion of the underlayer in each of a plurality of the first to fourth regions extends into a corresponding one of said cavities, and
• wherein the bottom portion of the underlayer in one of the plurality of regions extends further into its corresponding cavity than the bottom portion of another of the plurality of regions.