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US 7,408,259 B2Granted
Sheet to form a protective film for chips
AssigneeLintec Corporation
InventorsHideo Senoo, Takashi Sugino, Osamu Yamazaki
Life of this patent
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Abstract
A sheet to form a protective film for chips includes a release sheet and a protective film forming layer formed on a detachable surface of the release sheet. The protective film forming layer includes a thermosetting and/or energy ray-curable component and a binder polymer component.
Claims5
A sheet to form a protective film for chips which are mounted face down, consisting of a release sheet and a protective film forming layer formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting component and a binder polymer component.
Dependencies are inferred from the claim text.