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US 7,408,255 B2Granted
Assembly for stacked BGA packages
AssigneeMicron Technology, Inc.
InventorsDavid J. Corisis, Walter L. Moden, Leonard E. Mess, Larry D. Kinsman
Life of this patent
Estimating the term…
Abstract
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.
Claims19
A densely stacked component assembly having at least a component mounted on a first substrate and at least another component mounted on a second substrate, the densely stacked component assembly comprising:
- a plurality of first substrates, each first substrate of the plurality of first substrates having a first side, a second side, an aperture therethrough, at least one circuit having a portion located on the first side and on the second side thereof, and a plurality of connection areas on the first side thereof;
- a plurality of components, each component of the plurality having an active surface and a plurality of bond pads thereon, at least a portion of the active surface of each component secured to the first side of a first substrate of the plurality of first substrates, a wire extending through the aperture in the first substrate of the plurality of first substrates and connected to the portion of the at least one circuit on the second side of the first substrate and at least one bond pad of the plurality of bond pads on the active surface of a component of the plurality of components;
- a second substrate having a first side, a second side, and at least two circuits on the first side, one of the at least two circuits connected to the portion of the at least one circuit on the second side of the first substrate of the plurality of first substrates;
- at least one connection between the at least one circuit on the first substrate of the plurality of first substrates and the one of the at least two circuits of the second substrate;
- a jumper board having a first side, a second side, and at least one circuit thereon;
- a connection between one of the plurality of connection areas on the first side of the first substrate of the plurality of first substrates and the at least one circuit of the jumper board;
- and
- an electrical component connected to a circuit of the at least two circuits on the first side of the second substrate.
5 more elements
A stacked assembly having at least a component mounted on a first substrate and at least another component mounted on a second substrate, the stacked assembly comprising:
- a plurality of first substrates, each first substrate of the plurality of first substrates having a first side, a second side, an aperture therethrough, at least one circuit having a portion located on the first side and on the second side thereof, and a plurality of connection areas on the first side thereof;
- a plurality of components, each component of the plurality having an active surface and a plurality of bond pads thereon, at least a portion of the active surface of each component secured to the first side of a first substrate of the plurality of first substrates, a wire extending through the aperture in the first substrate of the plurality of first substrates and connected to the portion of the at least one circuit on the second side of the first substrate and at least one bond pad of the plurality of bond pads on the active surface of a component of the plurality of components;
- a second substrate having a first side, a second side, and at least two circuits on the first side, one of the at least two circuits connected to the portion of the at least one circuit on the second side of the first substrate of the plurality of first substrates;
- at least one connection between the at least one circuit on the first substrate of the plurality of first substrates and the one of the at least two circuits of the second substrate;
- a jumper board having a first side, a second side, and at least one circuit thereon;
- a connection between one of the plurality of connection areas on the first side of the first substrate of the plurality of first substrates and the at least one circuit on the jumper board;
- and
- an electrical component connected to a circuit of the at least two circuits on the first side of the second substrate.
5 more elements
An assembly having a component mounted on a first substrate and another component mounted on a second substrate, the assembly comprising:
- a plurality of first substrates, each first substrate of the plurality of first substrates having a first side, a second side, an aperture therethrough, at least one circuit having a portion located on the first side and on the second side thereof, and a plurality of connection areas on the first side thereof;
- a plurality of components, each component of the plurality having an active surface and a plurality of bond pads thereon, at least a portion of the active surface of each component secured to the first side of a first substrate of the plurality of first substrates, a wire extending through the aperture in the first substrate of the plurality of first substrates and connected to the portion of the at least one circuit on the second side of the first substrate and at least one bond pad of the plurality of bond pads on the active surface of a component of the plurality of components;
- a second substrate having a first side, a second side, and at least two circuits on the first side, one of the at least two circuits connected to the portion of the at least one circuit on the second side of the first substrate of the plurality of first substrates;
- at least one connection between the at least one circuit on the first substrate of the plurality of first substrates and the one of the at least two circuits of the second substrate;
- a jumper board having a first side, a second side, and at least one circuit thereon;
- a connection between one of the plurality of connection areas on the first side of the first substrate of the plurality of first substrates and the at least one circuit on the jumper board;
- and
- an electrical component connected to a circuit of the at least two circuits on the first side of the second substrate.
5 more elements
Dependencies are inferred from the claim text.