Stack land grid array package and method for manufacturing the same

A semiconductor device comprising:

• a substrate having a first surface, a second surface, and electrically conductive patterns formed on the first surface and the second surface of the substrate;
• a first semiconductor die attached to the first surface of the substrate;
• a first connection member for electrically coupling the first semiconductor die to at least one electrically conductive pattern on the first surface of the substrate;
• a first land extending from the first surface of the substrate, the first land having a first surface, a second surface approximately parallel to the first surface being electrically coupled to the at least one electrically conductive pattern on the first surface of the substrate;
• a second semiconductor die attached to the second surface of the substrate;
• a second connection member for electrically coupling the second semiconductor die to at least one electrically conductive pattern on the second surface of the substrate;
• a second land extending from the second surface of the substrate and having a first surface and a second surface approximately parallel to the first surface, the first surface of the second land being electrically coupled to the at least one electrically conductive pattern on the second surface of the substrate;
• and
• an encapsulant for encapsulating the first semiconductor die, the first connection member, the second semiconductor die, the second connection member, and the first and second land such that the first surface of the first land and the second surface of the second land is exposed, wherein the encapsulant comprises:
• a first encapsulant having an approximately planar first surface, a second surface approximately parallel to the first surface and coupled to the first surface of the substrate, and a third surface positioned along the periphery of the first and second surfaces while being approximately perpendicular to the first and second surfaces, the first surface of the first encapsulant approximately planar with the first surface of the first land, the first surface of the first land being exposed;
• and
• a second encapsulant having a first surface coupled to the second surface of the substrate, a second surface approximately parallel to the first surface, and a third surface positioned along the periphery of the first and second surfaces while being approximately perpendicular to the first and second surfaces.