Carrier with reinforced leads that are to be connected to a chip
AssigneeOki Electric Industry Co., Ltd.
InventorsSyuichi Yamanaka, Tomiichi Shibata
Life of this patent
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Abstract
This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a base having a device hole and a plurality of leads for bonding a chip, the leads are provided with thin heat-resistant films.
Claims14
A carrier for use with a chip, the carrier comprising a base having formed therein a hole for receiving the chip, a plurality of leads disposed on the base for bonding to the chip, and thin heat-resistant films provided over the base and the plurality of leads and extending beyond an edge of the hole, so as to adhere the leads around the periphery of the hole but not to cover end portions of the leads that are extended beyond the edge of the hole,
- wherein the thin heat-resistant films are provided at portions of upper and side surfaces of the leads, the portions being in the vicinity of the edge of the hole,
- wherein the thin heat-resistant films are further provided on lower surfaces of the leads at portions thereof which project into the hole, said portions not being areas of the leads for bonding to the chip, and
- wherein the base comprises base tape.
Dependencies are inferred from the claim text.