Semiconductor device with a recessed bond pad

A semiconductor device comprising:

• a semiconductor device with surface-mountable outer contacts, the surface-mountable outer contacts being arranged on outer contact connection surfaces on an underside of the semiconductor device,
• the outer contact connection surfaces having in their respective center region at least one recess which comprises a dovetail-like profile, wherein the recess defines a depth dimension with first and second ends at opposite ends of the depth dimension, and wherein the first and second ends define respective first and second width dimensions extending transverse to the depth dimension, the first width dimension being unequal to the second width dimension such that the dovetail-like profile generally defines a wedge shape,
• with the areal extent of the recess being smaller than the maximum cross section of an outer contact, and
• a printed circuit board having contact connection surfaces receiving the outer contacts.