Method for the removal of a microscopic sample from a substrate
AssigneeFEI Company
InventorHendrik Gezinus Tappel
Life of this patent
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Abstract
The invention provides a method for the removal of a microscopic sample 1 from a substrate 2, comprising the steps of: performing a culling process whereby the substrate 2 is irradiated with a beam 4 such that the sample is cut out of the substrate, and performing an adhesion process whereby the sample 1 is adhered to a probe 3, characterized in that the cutting process and the adhesion process overlap each other temporally. By simultaneously carrying out the culling process and the adhesion process, a time-saving is realized as compared to a method in which these processes are performed sequentially.
Claims16
A method for the removal of a microscopic sample from a substrate, comprising the steps of:
- performing a cutting process whereby the substrate is irradiated with a beam such that the sample is cut out of the substrate, and
- performing an adhesion process whereby the sample is adhered to a probe, characterized in that
- the cutting process and the adhesion process overlap each other temporally.
A method for the removal of a microscopic sample from a substrate, comprising the steps of:
- performing a cutting process whereby the substrate is irradiated with a beam such that the sample is cut out of the substrate, whereby the cutting process during at least a portion of the duration of the cutting process is carried out by two beams simultaneously, and performing an adhesion process whereby the sample is adhered to a probe, whereby the adhesion process comprises irradiating the sample with a beam,
- whereby the cutting process and the adhesion process overlap each other temporally and the orientation of the substrate in relation to the means which produce the cutting beams remains unchanged during the cutting process.
Dependencies are inferred from the claim text.