Measuring method and its apparatus
AssigneeHitachi High-Technologies Corporation
InventorsMayuka Oosaki, Hiroki Kawada, Ryo Nakagaki, Chie Shishido
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AssigneeHitachi High-Technologies Corporation
InventorsMayuka Oosaki, Hiroki Kawada, Ryo Nakagaki, Chie Shishido
Estimating the term…
A method for measuring a dimension of a pattern formed on a sample using a secondary electron image obtained by picking up an image of the sample using a scanning electron microscope includes: obtaining a secondary electron image of a sample by picking up an image of the sample using a scanning electron microscope; creating, using the secondary electron image, an image profile of a pattern whose dimension is to be measured, within the obtained secondary electron image; retrieving a model profile that matches best with the created image profile from a plurality of model profiles prestored that are obtained from respective secondary electron images of a plurality of patterns, the cross sections of the plurality of patterns being of known shapes and dimensions and being different in shape; and obtaining a dimension of the pattern using information of the retrieved model profile.
A method for measuring a dimension of a pattern, comprising the steps of:
A method for measuring a dimension of a pattern, comprising the steps of:
An apparatus for measuring a dimension of a pattern, comprising:
Dependencies are inferred from the claim text.