Electrical interconnection for high-frequency devices

An electrical interconnection comprising:

• a first planar transmission device having a first conductive region with a first edge;
• a second planar transmission device having a second conductive region with a second edge, the second edge being offset from the first edge;
• and
• a bond wire coupled to the first edge with a first bond and to the second edge with a second bond;
• wherein the first bond includes a first ball bond and a first intermediate bond, the first intermediate bond being closer to the first edge than the first ball bond;
• and
• wherein the first conductive region is a first center conductor of a first planar transmission line, the second conductive region is a second center conductor of a second planar transmission line, and the electrical interconnection further comprises
• a first opposite edge of the first center conductor;
• a second opposite edge of the second center conductor;
• and
• a second bond wire coupled to the first opposite edge with a third bond and to the second opposite edge with a fourth bond;
• wherein the first opposite edge is offset from the second opposite edge.

An electrical interconnection comprising:

• a first planar transmission device having a first conductive region with a first edge;
• a second planar transmission device having a second conductive region with a second edge, the second edge being offset from the first edge;
• and
• a bond wire coupled to the first edge with a first bond and to the second edge with a second bond,
• wherein the first bond includes a first ball bond and a first intermediate bond, the first intermediate bond being closer to the first edge than the first ball bond;
• and
• wherein the distance between the first intermediate bond and the second bond is smaller than the distance between the first ball bond and the second bond.

An electrical interconnection comprising:

• a first planar transmission device having a first conductive region with a first edge;
• a second planar transmission device having a second conductive region with a second edge, the second edge being offset from the first edge;
• and
• a bond wire coupled to the first edge with a first bond and to the second edge with a second bond;
• wherein the first bond includes a first ball bond and a first intermediate bond, the first intermediate bond being closer to the first edge than the first ball bond;
• and
• wherein the first conductive region is a first center conductor of a first planar transmission line, the second conductive region is a second center conductor of a second planar transmission line, and the electrical interconnection further comprises
• a first opposite edge of the first center conductor;
• a second opposite edge of the second center conductor;
• and
• a second bond wire coupled to the first opposite edge with a third bond and to the second opposite edge with a fourth bond;
• wherein the third bond includes a second ball bond and a second intermediate bond, the first ball bond being closer to an end of the first center conductor than the second ball bond.

An electrical interconnection comprising:

• a first planar transmission device having a first conductive region with a first edge;
• a second planar transmission device having a second conductive region with a second edge, the second edge being offset from the first edge;
• and
• a bond wire coupled to the first edge with a first bond and to the second edge with a second bond,
• wherein the first bond includes a first ball bond and a first intermediate bond, the first intermediate bond being closer to the first edge than the first ball bond;
• and
• wherein the first conductive region is a first center conductor of a first planar transmission line, the second conductive region is a second center conductor of a second planar transmission line, and the electrical interconnection further comprises
• a first opposite edge of the first center conductor;
• a second opposite edge of the second center conductor;
• and
• a second bond wire coupled to the first opposite edge with a third bond and to the second opposite edge with a fourth bond;
• wherein the third bond includes a second ball bond and a second intermediate bond, the first ball bond being closer to an end of the first center conductor than the second ball bond;
• and
• wherein the first center conductor has a width less than or equal to twice a bond target width.

An electrical interconnection comprising:

• a first planar transmission device having a first conductive region with a first edge;
• a second planar transmission device having a second conductive region with a second edge, the second edge being offset from the first edge;
• and
• a bond wire coupled to the first edge with a first bond and to the second edge with a second bond;
• wherein the first bond includes a first ball bond and a first intermediate bond, the first intermediate bond being closer to the first edge than the first ball bond;
• and
• wherein the first conductive region is a first center conductor of a first planar transmission line, the second conductive region is a second center conductor of a second planar transmission line, and the electrical interconnection further comprises
• a first opposite edge of the first center conductor;
• a second opposite edge of the second center conductor;
• and
• a second bond wire coupled to the first opposite edge with a third bond and to the second opposite edge with a fourth bond;
• wherein the first planar transmission device is a first microstrip transmission line and the second planar transmission device is a second microstrip transmission line.

An electrical interconnection comprising:

• a first planar transmission device having a first conductive region with a first edge;
• a second planar transmission device having a second conductive region with a second edge, the second edge being offset from the first edge;
• and
• a bond wire coupled to the first edge with a first bond and to the second edge with a second bond,
• wherein the first bond includes a first ball bond and a first intermediate bond, the first intermediate bond being closer to the first edge than the first ball bond;
• and
• wherein the first conductive region is a first ground plane of a first co-planar transmission line and the second conductive region is a second ground plane of a second co-planar transmission line.

An electrical interconnection comprising:

• a first planar transmission device having a first conductive region with a first edge;
• a second planar transmission device having a second conductive region with a second edge, the second edge being offset from the first edge;
• and
• a bond wire coupled to the first edge with a first bond and to the second edge with a second bond,
• wherein the first bond includes a first ball bond and a first intermediate bond, the first intermediate bond being closer to the first edge than the first ball bond;
• and
• wherein the first planar transmission device is a first slot line and the second planar transmission device is a second slot line.

An electrical interconnection comprising:

• a first planar transmission device having a first conductive region with a first edge;
• a second planar transmission device having a second conductive region with a second edge, the second edge being offset from the first edge;
• and
• a bond wire coupled to the first edge with a first bond and to the second edge with a second bond,
• wherein the first bond includes a first ball bond and a first intermediate bond, the first intermediate bond being closer to the first edge than the first ball bond;
• and
• wherein the second planar transmission device comprises an integrated circuit and further comprising:
• a second bond wire coupled to an opposite edge of the first conductive region with a third bond and to the second conductive region with a fourth bond.

An electrical interconnection comprising:

• a first planar transmission device having a conductive region with a first edge and a second edge;
• a component;
• a first bond wire coupled to a first edge with a first ball bond and a first intermediate bond, and to the component with a first end bond:
• and
• a second bond wire coupled to the second edge with at least a second ball bond and to the component with a second end bond, wherein the first intermediate bond is closer to the first edge than the first ball bond.