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US 7,407,878 B2Granted
Method of providing solder bumps on a substrate using localized heating
AssigneeIntel Corporation
InventorYonggang Li
Life of this patent
Estimating the term…
Abstract
A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate. The method includes: providing a microelectronic substrate including electrode pads exhibiting an electrode pad pattern; providing solder portions onto respective ones of the electrode pads according to the electrode pad pattern; reflowing the solder portions to form solder bumps therefrom, reflowing comprising applying localized heating to each of the solder portions to reflow the same.
Claims18
A method of providing electrically conductive bumps on electrode pads of a microelectronic substrate comprising:
- providing a microelectronic substrate including electrode pads exhibiting an electrode pad pattern;
- providing solder portions onto respective ones of the electrode pads according to the electrode pad pattern, wherein the electrode pads have non-uniform sizes, and wherein the solder portions have non-uniform sizes as a function of non-uniform sizes of the electrode pads;
- reflowing the solder portions to form solder bumps therefrom, reflowing comprising applying localized heating to each of the solder portions to reflow the same, wherein reflowing comprises controlling the localized heating to apply localized heating at differing power levels as a function of a composition and volume of a solder portion being reflowed.
Dependencies are inferred from the claim text.