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US 7,407,833 B2Granted
Process for fabricating chip package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorJeng-Da Wu
Life of this patent
Estimating the term…
Abstract
A chip package structure comprising a carrier, a chip and an underfill layer is disclosed. The carrier has a plurality of bumps disposed thereon. The chip has an active surface. The chip is flip-chip bonded and electrically connected to the carrier through the bumps such that the active surface of the chip faces the carrier. The underfill layer is disposed on the carrier between the chip and the carrier such that a gap is maintained between the underfill layer and the chip.
Claims11
A chip packing process, comprising the steps of:
- providing a carrier and a chip, wherein the carrier has a plurality of bumps disposed thereon and the chip has an active surface;
- after the step of providing the carrier and the chip, forming an underfill layer on a surface of the carrier having the bumps thereon, wherein the underfill layer is disposed between the bumps but without enclosing the bumps;
- and
- after the step of forming the underfill layer, flip-chip bonding the chip to the carrier so that the chip and the carrier are electrically connected through the bumps.
1 more element
A chip packaging process, comprising the steps of:
- providing a carrier and a chip, wherein the carrier has a plurality of first bumps thereon and the chip has an active surface;
- after the step of providing the carrier and the chip, forming an underfill layer on the surface of the carrier, wherein the first bumps are formed on said surface and the underfill layer exposes the first bumps;
- after the step of forming the underfill layer, forming a plurality of second bumps over the first bumps such that each of the second bumps is formed on one of the first bumps respectively;
- and
- after the step of forming the second bumps over the first bumps, flip-chip bonding the chip to the carrier so that the chip and the carrier are electrically connected through the first bumps and the second bumps.
2 more elements
Dependencies are inferred from the claim text.