US 7,407,712 B2 · Release film

Abstract

It is an object of the present invention to provide a release film which is superior in the flexibility at high temperature, the conformability to circuit patterns, the heat resistance, the releasing property and the non-contaminative property, and easily discarded after use. The present invention relates to a release film, which is used in a manufacturing process of a printed-circuit board, a flexible printed-circuit board or a multilayer printed-circuit board, having a layer comprising a resin composition comprising a resin having a polar group in a main chain as a matrix and having a halogen content of 5% by weight or less on at least one surface.

Claims6

Dependent claims

A release film,

which is used in a manufacturing process of a printed-circuit board, a flexible printed-circuit board or a multilayer printed-circuit board,
said release film not including a laminar silicate and having a layer consisting essentially of a resin composition comprising a resin having a polar group in a main chain as a matrix and having a halogen content of 5% by weight or less on at least one surface,
wherein the resin having a polar group in a main chain is crystalline aromatic polyester, and
wherein an outgas generation rate in the case of heating the release film at 170° C. for 10 minutes is 200 ppm or less.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

10/549,115Filed 26 Dec 2003

Published

US 2006/0154095 A113 Jul 2006

Granted

5 Aug 2008

Term ends

Not estimatedThe source records don’t support an estimate.

Classification18 codes

B32B 27/36
Layered products comprising a layer of synthetic resin: comprising polyesters
C08J 5/18
Manufacture of articles or shaped materials containing macromolecular substances: manufacture of films or sheets
H05K 3/022
In which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface…:…
B32B 2307/308
Having particular thermal properties: heat stability

Release film

Life of this patent

Release film

Life of this patent

Abstract

Claims6