US 7,407,605 B2Granted

Manufacturable CoWP metal cap process for copper interconnects

AssigneeInternational Business Machines Corporation

InventorsDarryl D. Restaino, Donald F. Canaperi, Judith M. Rubino, Sean P. E. Smith, Richard O. Henry, James E. Fluegel, Mahadevaiyer Krishnan

Life of this patent

Estimating the term…

Abstract

An aqueous seeding solution of palladium acetate, acetic acid and chloride.

Claims3

Dependent claims

A seeding solution for depositing a palladium seed on copper comprising an aqueous solution of palladium acetate, acetic acid, and hydrochloric acid.

Dependencies are inferred from the claim text.

Facts

Application: 11/751,788Filed 22 May 2007 · division
Priority: 22 Dec 2004
Published: US 2007/0215842 A120 Sep 2007
Granted: 5 Aug 2008
Term ends: Not estimatedThe source records don’t support an estimate.

Classification15 codes

H10P 14/46
Of conductive or resistive materials: using a liquid
C23C 18/1241
Composition of the substrate: metallic substrates
C23C 18/1607
Coating on selected surface areas: by direct patterning
C23C 18/1608
By direct patterning: from pretreatment step, i.e. selective pre-treatment

Family

Application10/905,230Parent of this division · filed 22 Dec 2004
US 2007/0215842 A1Pre-grant publication · published 20 Sep 2007
US 7,253,106 B2Parent of this division
US 2006/0134911 A1Published application
US 7,407,605 B2This patent

From the US filing history. Foreign family members aren’t listed.

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