Polymeric particle slurry system and method to reduce feature sidewall erosion

A slurry system for an improved low-K oxide/copper chemical mechanical polishing (CMP) process to reduce copper damascene sidewall erosion comprising:

• an alkaline aqueous dispersion comprising abrasive particles, said abrasive particles consisting essentially of particles comprising a first material having an elastomeric polymer outer surface, said first material surrounding a core comprising a second material, said second material different from said first material, said abrasive particles in said alkaline aqueous dispersion capable of exhibiting elastic behavior during the CMP process, said elastomeric polymer only on said particles in said alkaline aqueous dispersion.

A slurry system for an improved low-K oxide/copper chemical mechanical polishing (CMP) process to reduce copper damascene sidewall erosion comprising:

• an alkaline aqueous dispersion comprising abrasive particles, said abrasive particles consisting essentially of particles comprising a first material having an elastomeric polymer outer surface, said first material surrounding a core comprising a second material, said second material different from said first material, said abrasive particles in said alkaline aqueous dispersion capable of exhibiting elastic behavior during the CMP process, said elastomeric polymer only on said particles in said alkaline aqueous dispersion;
• wherein said alkaline aqueous dispersion has a pH of between about 7.0 and about 10.0, and,
• wherein said alkaline aqueous dispersion has a solids content of said particles of between about 0.5 and about 6.5 weight percent of the total weight of the aqueous dispersion.