Back to results
US 7,407,433 B2Granted
Pad characterization tool
AssigneeApplied Materials, Inc.
InventorsRashid A. Mavliev, Simon Yavelberg, Gerald J. Alonzo
Life of this patent
Estimating the term…
Abstract
Tools and methods for in-situ characterizing of a surface of a polishing pad are described. A characterization tool is integrated with polishing tool so that the polishing pad can be monitored in-situ. The characterization tool and the polishing pad can be rotated or moved so that any portion of the polishing pad can be tested.
Claims18
A polishing tool configured to characterize the surface of a polishing pad, comprising:
- a carrier head support supporting a carrier head configured to retain a substrate during a polishing process;
- a platen configured to support a conductive polishing pad, wherein the substrate contacts the conductive polishing pad during the polishing process;
- and
- a sensor assembly, wherein the sensor assembly is configured to contact a conductive portion of the conductive polishing pad and apply a bias to the conductive portion to determine conductivity of the conductive polishing pad.
1 more element
A method of determining a condition of a conductive polishing pad, comprising:
- positioning a conductive polishing pad on a polishing tool;
- positioning a characterization tool over a surface of the conductive polishing pad;
- and
- operating the characterization tool while the tool is in contact with a conductive portion of the conductive polishing pad to determine conductivity of the conductive polishing pad, wherein operating the characterization tool includes applying a bias to the conductive portion.
1 more element
Dependencies are inferred from the claim text.